New Copper Bonding Products for Telecommunications Will Grow Carrier Ethernet and Wireless Backhaul Markets Worldwide, Says Insight Research Corporation
BOONTON, N.J. – Feb. 5 (SEND2PRESS NEWSWIRE) — A new class of hardware product that bonds together multiple slower-speed copper circuits into a high-speed link promises to extend the worldwide market penetration of carrier Ethernet services as well as lower backhaul costs for wireless and DSL services, says a market analysis study from Insight Research. On a worldwide basis, carriers’ revenue from the three applications of the new copper bonding technology will sharply increase over the next five years.