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IPAC Announces High-Volume QFN Production Onshore
SAN JOSE, Calif. - Nov. 14, 2003 /Send2Press Newswire/ -- Integrated
Packaging Assembly Corporation ("IPAC" - www.ipac.com), an IC packaging
foundry in Silicon Valley, announced that they are the only US source
for high-volume QFN (Quad-Flat package, No-lead) package assembly.
With ample available capacity at their conveniently located, ISO-9002
certified San Jose facility, the company turns all production orders in
less than one week door-to-door and can accommodate urgent lots as
quickly as 24 hours. Related services including testing and wafer
thinning are also offered as a turnkey solution.
"QFN-type packaging is rapidly becoming the IC package used for most
chips with less than 100 I/Os," said Chris Ooi, IPAC s executive VP.
"The near-chip-scale leadframe based platform offers numerous and
significant advantages over other IC package types," he points out.
"These improvements include low cost, small footprint, high reliability,
high thermal and electrical performance, and low tooling and
manufacturing costs. These features make QFN and related outlines
suitable for a huge range of IC products including RF, analog, mixed
signal and logic, especially those used in portable and wireless
With QFN packaging, IPAC is the domestic packaging foundry with by far
the most package types available. The company's production capabilities
include QFP, QFN, BGA, FBGA, Flip-Chip and SiP. Advanced wafer-level
and system-level packaging solutions are also under development and
planned for introduction in 2004.
IPAC provides IC package assembly, testing and manufacturing support to
the semiconductor industry. The company s manufacturing services are
carried out at its Silicon Valley facility where a wide range of package
offerings are combined with superior service and fast delivery. For
more information, visit IPAC's web site at: http://www.ipac.com.
Organization Website: www.ipac.com
Source of News:
IPAC (Integrated Packaging Assembly Corp.)
California Technology Newswire
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