FREMONT, Calif., June 3, 2013 (SEND2PRESS NEWSWIRE) -- TeamF1, Inc. (www.TeamF1.com), the leader in embedded networking and security software solutions for wired and wireless applications, today announced support for the new state-of-the-art Voledia 5 platform from Open-Silicon, Inc. Open-Silicon is a leading provider of semiconductor platforms that enable intelligent processing for networking, communications, and the digital home. The combination of TeamF1's turnkey software solutions and Open-Silicon's powerful Voledia 5 platform is ideally suited for residential and service provider CPE gateways that feature advanced broadband technologies, high-performance wireless networking, and innovative mobile and cloud-friendly features.
"We believe Open-Silicon's Voledia 5 platform is an excellent fit for our mutual customers," said Mukesh Lulla, president of TeamF1. "This platform excels in providing high performance combined with an efficient power profile at a very cost-effective price point. We are confident that our ongoing strategic efforts with Open-Silicon will provide the high quality and performance that our mutual customers have come to expect, while mitigating integration risk and lowering development costs."
"TeamF1 has a history of executing a best-of-breed strategy by combining its innovative SecureF1rst software with the best processors in the market to reduce the time to deployment and development risk for its customers," said Steve Erickson, General Manager and Vice President Platform BU at Open-Silicon. "By working closely with TeamF1 to pre-optimize its software for our silicon platform, Open-Silicon enables its customers to rapidly take to production advanced gateway applications built on our Voledia 5 platform."
TeamF1 develops and markets highly integrated, hardware-accelerated embedded networking and security software solutions targeted towards network equipment and internet access devices for homes and small businesses. TeamF1's SecureF1rst software drives a multitude of secure embedded networking devices available from leading OEMs. TeamF1's collaboration with Open-Silicon demonstrates its commitment to provide seamlessly integrated products that combine the rich connectivity, security and device management functionality of its SecureF1rst platform with the native hardware-accelerated resources that modern System-on-Chip (SoC) processors bring to the table.
The Voledia 5 platform from Open-Silicon provides a customizable platform with integrated Deep Packet Inspection (DPI) engine to perform critical security and application aware value added services, a strong requirement for the next generation Digital Home and Office market. In addition, the Voledia 5 platform offers high performance home networking capabilities, application aware QoS, and packs an unparalleled 7,500 DMIPs performance. The Voledia 5 platform is ideal to enable the next generation IEEE802.11ac AP routers, residential and Small and Medium Business (SMB) gateways, and storage devices.
A demonstration of TeamF1's SecureF1rst solutions on Open-Silicon's Voledia 5 platform will be presented at Taiwan International Convention Center (TICC) Meeting Rooms "Cozy Corner" (1st Floor ) from June 3 - June 7 at 1 Hsin-Yi Road, Section 5., Taipei, Taiwan. Appointments for meetings can be made by contacting us at +886 (933) 760-292 or by filling out a contact form at: http://TeamF1.com/home/computex-contact-form .
TeamF1, Inc. a privately held corporation headquartered in Fremont, California, is a leader in high performance embedded networking and security software. TeamF1's products enable secure networking of telecom/datacom and industrial equipment. For more information visit http://www.TeamF1.com/ or contact TeamF1 Public Relations at 510-505-9931.
Open-Silicon, a leading supplier and developer of customer-specific products (CSPs), provides ASICs, platforms, concept-to-parts development, customized IP, low-effort derivative design, and state-of-the-art manufacturing solutions. With Open-Silicon, customer's benefit from global engineering including an ARM(R) Technology Center of Excellence, advanced SerDes integration, 2.5D interposer-based package engineering, experienced architects, leading-edge physical design methodology, and embedded software development, all leveraging the industry's best technology from both Open-Silicon and the open market. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.
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